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有色金属(冶炼部分):2015,(1):57-61
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硫氰酸盐-双氧水体系回收废电路板中的金
王治科,郭翔,叶存玲
(河南师范大学环境学院 河南省环境污染控制重点实验室,河南师范大学环境学院 河南省环境污染控制重点实验室,河南师范大学环境学院 河南省环境污染控制重点实验室)
Gold Recovery from Waste Printed Circuit Boards in Thiocyanate-hydrogen Peroxide Systems
WANG Zhi-ke,GUO Xiang and YE Cunling
(School of Environment,Henan Normal University,Henan Key Laboratory for Environmental Pollution Control,Key Laboratory for Yellow River and Huai River Water Environment and Pollution Control,Ministry of Education,,)
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投稿时间:2014-07-29    修订日期:2014-07-30
中文摘要: 采用硫氰酸盐—双氧水浸金体系从废电路板中回收金和银,详细考察了硫氰酸盐浓度、双氧水浓度、溶液pH、固液比、温度和搅拌速度等对金银浸出率的影响。结果表明,在0.05 mol/L H2O2、0.4 mol/L SCN-、固液比1/250、搅拌速度200 r/min、室温(~15 ℃)浸取8 h的条件下,金、银浸出率分别超过90%和79%,铅浸出率为9.7%。
中文关键词: 硫氰酸盐  双氧水  废电路板    
Abstract:Gold and silver were recovered from waste printed circuit boards in thiocyanate-hydrogen peroxide systems. The effects of thiocyanate concentration, hydrogen peroxide concentration, pH value of solution, ratio of solid to liquid (S/L), temperature and stirring speed on leaching rates of Au and Ag were investigated. The results show that leaching rates of Au, Ag and Pb are 90% above, 79% above, and 9.7%, respectively under the optimum conditions including H2O2 concentration of 0.05 mol/L, thiocyanate concentration of 0.4 mol/L, S/L=1/250, stirring speed of 200 r/min, room temperature (~15 ℃) and leaching time of 8 h.
文章编号:     中图分类号:TF831; TF832    文献标志码:
基金项目:河南省高等学校青年骨干教师项目(2010GGJS-067);河南省创新型科技人才队伍建设工程项目(2011)
引用文本:
王治科,郭翔,叶存玲.硫氰酸盐-双氧水体系回收废电路板中的金[J].有色金属(冶炼部分),2015(1):57-61.
WANG Zhi-ke,GUO Xiang,YE Cunling.Gold Recovery from Waste Printed Circuit Boards in Thiocyanate-hydrogen Peroxide Systems[J].Nonferrous Metals (Extractive Metallurgy),2015(1):57-61.

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