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| Effect of Alloying on Wettability and Microstructure of Sn-9Zn Lead-free Solder Alloy |
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| DOI：doi：10.3969/j.issn.1007-7545.年份.期号.顺序号 |
| KeyWord:Lead-free solders,Sn-9Zn,Wettability,Interface,Microstructure |
| HUANG Hui-zhen,WEI Xiu-qin,ZHOU Lang |
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| Abstract: |
| Investigations are carried out in order to study the effects of Bi, mixed rare earths RE and P on the wettability of Sn-9Zn lead-free solder alloy to Cu substrate, and on the microstructures of the alloy and the interface between the solder and Cu. The results show that Bi, RE and P can effectively improve the wettability. But RE and P have no significant effect on the solder/Cu interfaces and do not change the besom-shape eutectic microstructure of Sn-9Zn solder alloy, while Bi enhances the precipitation of Zn in the Sn-9Zn alloy. |
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