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| Polishing Rate and Dependent Factors of Copper in CeO2 Slurry Containing KIO3 during CMP |
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| DOI：doi：10.3969/j.issn.1007-7545.年份.期号.顺序号 |
| KeyWord:CMP;CeO2 |
| HU Jian-dong,LI Yong-xiu,ZHOU Xue-zhen |
| 1 School of Science and Technology of Material, Nanchang University, Nanchang 330031, China; 2. School of Science, Nanchang University, Nanchang 330047, China |
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