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| Preparation of the Multi-layer Copper and Nickel Foam by Electrodeposition |
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| DOI：doi：10.3969/j.issn.1007-7545.年份.期号.顺序号 |
| KeyWord:Multi-layer copper/nickel;Electrodeposition;Preparation; |
| ZHANG Qiu-li1,CHENG Yan-kun2,ZHOU Jun1 |
| 1.Institute of Metallurgy Engineering;Xi'an University of Architecture and Technology;Xi'an 710055;China;2.Hebei Chemical and Pharmaceutical Vocational Technology College;Shijiazhuang 050026;China |
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| Abstract: |
| The multi-layer copper/nickel foam was prepared by the electrodeposition methods adopted the polyurethane as frame foundation.The foam is provided with a three-dimension grid structure and high porosity.The morphology of foam was examined by scanning electron microscope in synthesis procedure.The main physical characteristics of multi-layer copper/nickel foam were determined. |
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