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| Effects Factors on Removal Rate of Polishing Powder |
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Received:March 30, 2011
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| DOI：DOI：10.3969/j.issn.1007-7545.2011.09.012 |
| KeyWord:Polishing powder；Removal rate；CeO2；Chemically mechanical polishing(CMP) |
| Author | Institution |
| LI Ying-yi |
南昌大学材料科学与工程学院 |
| CHEN Wei-fan |
南昌大学材料科学与工程学院 |
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| Abstract: |
| Removal rate is used as property index of evaluating polishing powder. The effects of slurry concentration, polishing time, calcinations temperature of cerium-based polishing powder and system temperature on ZF6-type optical glass is researched in detail. |
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