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| Reduction Smelting of Silver Separating Residue from Circuit Board Copper Anode Slime |
| Received:May 23, 2011 |
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| DOI：doi：10.3969/j.issn.1007-7545.2011.12.009 |
| KeyWord:Circuit board copper anode slime；Silver separating residue；Reduction smelting；Lead-tin alloy |
| Author | Institution |
| LIU Yong, LIU Zhen-zhen, LIU Mu-dan |
广州有色金属研究院 |
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| Abstract: |
| The recovery of valuable metals from silver separating residue from circuit board copper anode slime was studied by reduction smelting. The optimum reduction smelting conditions included temperature of 1 150 ℃, time of 30~45 min, consumption of Na2CO3 of 15%, consumption of carbon powder of 15%, and consumption of borax of 6.0%~10.0%. As a result, the ingot was separated well from slag, and the metal production rate reached 65.2%, lead recovery was 97.84%, tin recovery was 88.88%, and precious metal recovery was over 95%. |
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