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| Thermal Fatigue Properties of ZCuSn10P1 under Different Heat Treatment |
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Received:November 03, 2011
Revised:November 05, 2011
Accepted:November 07, 2011
Published Online:April 23, 2012
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| DOI：doi：10.3969/j.issn.1007-7545.2012.05.016 |
| KeyWord:heat treatment; thermal fatigue; plasticity; crack propagation rate; copper alloy; ZCuSn10P1 |
| Author | Institution |
| Zhangxue |
江苏大学材料科学与工程学院 |
| Si Naichao |
江苏大学材料科学与工程学院 |
| Si Songhai |
镇江忆诺唯记忆合金有限公司 |
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| Abstract: |
| Thermal fatigue properties of ZCuSn10P1 alloy at 20~500 ℃ under different heat treatment were researched. The results show that the alloy’s plasticity is improved, δ-phase is reduced and tin is diffused into copper matrix after heat treatment. The anti-fatigue property of sample heat treated at 630 ℃ for holding 50 min and then water quenched is optimal. In the range of 20~500 ℃, crack length (L) is proportional to a order of cycle number (N) (a>1), and crack propagation rate(v) is proportional to (a－1) order of N (a>1). |
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