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| Study on Zn-Ni Alloy Used for Stripping Layer of Ultra-thin Copper Foil with Carrier Foil |
| Received:July 30, 2012 Revised:August 02, 2012 |
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| DOI：doi：10.3969/j.issn.1007-7545.2013.01.013 |
| KeyWord:Zn-Ni alloy; ultra-thin copper foil; stripping layer |
| Author | Institution |
| Gengfeng-Deng |
江西理工大学冶金与化学工程学院 |
| Jueqi-Huang |
江西理工大学冶金与化学工程学院 |
| Yuanteng-Lai |
江西理工大学冶金与化学工程学院 |
| Peng-Xu |
江西理工大学冶金与化学工程学院 |
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| Abstract: |
| High-zinc and low-nickel alloy coating used for stripping layer on 35 μm ultra-thin copper foil as carrier foil was electrodeposited. Ultra-thin copper foil was electrodeposited in pyrophosphate solution, and then ultra-thin copper carrier foil was prepared. The effects of ratio of zinc sulfate and nickel sulfate, dosage of complexing agent of potassium pyrophosphate trihydrate, dosage of additives of gelatin on the properties of stripping layer were investigated. The results show that zinc and nickel can be co-electroplated under the conditions including zinc sulfate of 12 g/L, nickel sulfate of 6 g/L, potassium pyrophosphate trihydrate of 0.5 mol/L, gelatin of 0.2 g/L and sodium dodecyl benzene sulfonate 0.2~0.3 g/L. Peelable strength between ultra-thin copper foil and carrier copper foil is stable and can reach 4.7 N/cm when zinc-nickel alloy is used as a stripping layer. |
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