Selective Leaching of Gold and Silver from Waste Printed Circuit Boards in Thiocyanate-Ferric System
Received:April 13, 2013   Revised:April 16, 2013   Accepted:April 17, 2013      Published Online:October 25, 2013
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DOI:10.3969/j.issn.1007-7545.2013.11.011
KeyWord:thiocyanate; leaching; waste printed circuit boards; gold; silver
        
AuthorInstitution
WANG Zhi-ke 河南师范大学环境学院 河南省环境污染控制重点实验室
ZhANG Han 河南师范大学环境学院 河南省环境污染控制重点实验室
YE Cun-ling 河南师范大学环境学院 河南省环境污染控制重点实验室
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Abstract:
      Gold and silver were selectively leached with thiocyanate process from residue obtained by H2SO4-H2O2 system to pretreat metallic fractions of waste printed circuit boards. The parameters of concentrations of thiocyanate and ferric, pH value, ratio of liquid to solid (L/S), stirring speed, temperature and leaching time were optimized. The results show that gold and silver extraction rate are 95% and 99% respectively and lead leaching rate does not exceeded 4.5% under the optimum conditions including concentration of Fe3 of 0.1 mol/L, concentration of SCN- of 0.6 mol/L, pH of 2, L/S=500/2, stirring speed of 200 r/min, temperature of 15 ℃, and leaching time of 8 h.
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