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| Study on Preparation of Ultra-Thin Copper Foil |
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Received:July 22, 2013
Revised:July 24, 2013
Accepted:July 25, 2013
Published Online:January 20, 2014
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| DOI：10.3969/j.issn.1007-7545.2014.12.014 |
| KeyWord:carrier foil; peelable foil; ultra-thin copper foil |
| Author | Institution |
| Gengfeng-Deng |
江西理工大学冶金与化学工程学院 |
| Guirong-He |
江西理工大学冶金与化学工程学院 |
| Jueqi-Huang |
江西理工大学冶金与化学工程学院 |
| Peng Xu |
江西理工大学冶金与化学工程学院 |
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| Abstract: |
| The preparation technology of ultra-thin copper foil with carrier foil was studied. The effects of current density, electro deposition time, stirring method and solution temperature on surface morphology of ultra-thin copper foil were investigated with SEM. The results show that the optimal conditions to form of ultra-thin copper foil layer with thickness of less 5 μm include ultrasonic stirring, solution temperature of 45~50 ℃, current density of 15 A/dm2, and electrodeposited on the glossy side of carrier foil for 6 s. |
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