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| Performance Analysis on Interlayer of High Purity Aluminum and Copper Bonded by Explosive Welding |
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Received:October 17, 2013
Revised:October 21, 2013
Accepted:October 23, 2013
Published Online:April 22, 2014
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| DOI：10.3969/j.issn.1007-7545.2014.05.015 |
| KeyWord:high purity aluminum; explosive welding; ultrasonic nondestructive testing; microstructure |
| Author | Institution |
| Chen Ming |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
| Wan Xiaoyong |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
| Dong Tingyi |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
| He Jinjiang |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
| Gao Yan |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
| Lv Baoguo |
北京有色金属研究总院，有研亿金新材料股份有限公司 |
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| Abstract: |
| High purity aluminum and copper were bonded by explosive welding. The bonding plate was nondestructive tested by C-scan. The welding properties of Al/Cu composite plate were analyzed in terms of microstructure and mechanical properties. The results show that C-scan, as a nondestructive testing method, can detect bonding quality rapidly. Existing in combined interface after welding, strip stress zones disappear with no grain growth after heat treatment. Explosive welding can realize the strength weld between high purity aluminum and copper with tensile strength of combined interface of about 43 MPa. |
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