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| Study of Oxygen Pressure Acid Leaching Pretreatment Technology for Copper Anode Slime |
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Received:January 04, 2014
Revised:January 10, 2014
Accepted:January 13, 2014
Published Online:June 23, 2014
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| DOI：10.3969/j.issn.1007-7545.2014.07.005 |
| KeyWord:copper anode slime; oxygen pressure acid leaching; tellurium; selenium; leaching rate |
| Author | Institution |
| ZhONG Qing-Shen |
西安建筑科技大学 冶金工程学院 |
| HE Xiu-Zhen |
金川集团股份有限公司/贵金属冶炼厂/贵金属研究中心 |
| MA Yu-Tian |
金川集团股份有限公司 |
| LIU Yu-Qiang |
金川集团股份有限公司 |
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| Abstract: |
| Oxygen pressure acid leaching process for copper anode slime was studied. The effects of initial concentration of sulfuric acid, leaching temperature and time, ratio of liquid to solid (L/S), and pressure on leaching were investigated. The results show that leaching slag rate is 55%~60%, tellurium leaching rate is 85%~90%, and leaching rate of nickel and copper is 99% above under the optimum conditions including initial concentration of sulfuric acid of 130~150 g/L, temperature of 155~165 ℃, time of 6~8 h, L/S=5∶1, and leaching pressure of 1.0~1.5 MPa. |
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