|
| Electrochemical Behavior of Copper in Eutectic LiCl-KCl Melt |
|
Received:March 26, 2015
Revised:April 06, 2015
Accepted:April 07, 2015
Published Online:July 17, 2015
|
| View Full Text View/Add Comment Download reader |
| DOI：doi：10.3969/j.issn.1007-7545.2015.08.001 |
| KeyWord:molten chlorides, copper, electrochemical test, diffusion coefficient |
| Author | Institution |
| CAI Yan-qing |
东北大学 材料与冶金学院 辽宁沈阳 |
| LIU Hong-xia |
东北大学 材料与冶金学院 辽宁沈阳 |
| Xu Qian |
上海大学 材料科学与工程学院 上海 |
| Song Qiu-shi |
东北大学 材料与冶金学院 辽宁沈阳 |
| Xu Liang |
东北大学 材料与冶金学院 辽宁沈阳 |
|
| Hits: 2964 |
| Download times: 2950 |
| Abstract: |
| The electrochemical behavior of Cu(I) in eutectic LiCl-KCl (58.5︰41.5 mol ratio) melt was investigated on graphite and Mo electrodes at 500 ℃ by cyclic voltammetry, square wave voltammetry, chronopotentiometry, and linear sweep voltammetry. The cathodic peak currents and initial deposition potentials of copper under different concentrations of CuCl were obtained. The results show that two initial reduction potentials of copper ions are obtained at -1.05 V and -1.55 V on graphite electrode, which correspond to Cu(II)/Cu(I), and Cu(I)/Cu(0) couples, respectively. Reduction of Cu(I) is a quasi-reversible process controlled by diffusion mass transfer. The diffusion coefficients of Cu(I), calculated by the results of cyclic voltammetry and chronopotentiometry, is 1.79×10-5 cm2/s and 1.26×10-5 cm2/s, respectively. |
| Close |
|
|
|