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| Study on High-temperature Oxidation Properties of New Copper-based Electrical Contact Materials |
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Received:September 29, 2015
Revised:November 02, 2015
Accepted:November 03, 2015
Published Online:March 21, 2016
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| DOI：10.3969/j.issn.1007-7545.2016.04.014 |
| KeyWord:copper-based electrical contact materials; high-temperature oxidation; micromorphology |
| Author | Institution |
| WANG Li |
贵州大学材料与冶金学院 |
| ZHANG Xiao-yan |
贵州大学材料与冶金学院 |
| LEI Yuan-yuan |
贵州大学材料与冶金学院 |
| ZHANG Jun-jie |
贵州大学材料与冶金学院 |
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| Abstract: |
| High-temperature oxidation properties of new copper-based electrical contact material at cast and heat-treatment states were studied. Micromorphology of surface oxide films was observed by SEM. The results show that compared with cast materials, heat-treatment copper-based materials have higher compactness and continuity of surface oxide film, lower oxidation mass gain, and better antioxidation property. |
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