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| Effect of Deformation Aging on Mechanical Properties and Electrical Conductivity of Cu-1.3Ni-0.3Si Alloy |
| Received:March 28, 2017 Revised:April 04, 2017 |
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| DOI：doi：10.3969/j.issn.1007-7545.2017.08.014 |
| KeyWord:Cu-Ni-Si alloy; aging; pre-deformation degree; microstructure; properties; electrical conductivity |
| Author | Institution |
| PAN Shaobin |
江西理工大学 材料科学与工程学院 |
| WANG Zhixiang |
江西理工大学 材料科学与工程学院 |
| YE Yan-jun |
江西理工大学 材料科学与工程学院 |
| LIAO Yue-hui |
江西理工大学 材料科学与工程学院 |
| LIU Feng |
宁波兴业盛泰集团有限公司 |
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| Abstract: |
| Effect of aging process with 400~550 ℃ for 1~8 h on microstructure and properties of Cu-1.3Ni-0.3Si alloy with 0~70% cold deformation was investigated by OM, SEM and EDS. The results show that hardness of alloy with different cold deformation reaches the peak value after aging at 450 ℃ for 1 h. Upon temperature rising to 500 ℃, the electrical conductivity of alloy reaches the maximum value, with a large number of fine dispersed second phase particles in the matrix structure. Conductivity of alloy rises constantly with extension of holding time. The greater degree of deformation is, the more obvious alloy conductivity rises. Hardness of alloy with 70% pre-cooling deformation after aging at 450 ℃ for 3 h is 180HB and conductivity is 52%IACS. Compared to untreated alloy, the maximum hardness of alloy after aging rises by about 21%, and electrical conductivity rises by about 11%. |
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