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| Research Program of Cyanide-Free Au-Coated Silver Wire |
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Received:December 19, 2017
Revised:December 28, 2017
Accepted:January 02, 2018
Published Online:May 17, 2018
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| DOI：doi：10.3969/j.issn.1007-7545.2018.06.014 |
| KeyWord:package; bonding wire; cyanide-free plating; property |
| Author | Institution |
| Li Feng |
重庆材料研究院有限公司 |
| Tang Huiyi |
重庆材料研究院有限公司 |
| Wu Baoan |
重庆材料研究院有限公司 |
| Luo Wei Fan |
重庆材料研究院 |
| Luo FengLan |
重庆材料研究院有限公司 |
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| Abstract: |
| Though with better electrical and thermal properties, and low production cost compared with bonding gold wire, bonding silver wire cannot replace bonding gold wire completely in high density integrated circuit packaging industry due to its low oxidation and sulfuration resistance. Au-coated silver wire prepared by gold plating on silver wire surface has high oxidation resistance, better spheronization, and high reliability. The development prospect of cyanide-free gold plating process and cyanide-free Au-coated silver (ACA) wire are introduced. |
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