Study on Indium Leaching and Silicon Precipitation from Indium-Rich High-Silicon Bearing Slag during Oxygen Pressure Acid Leaching
Received:September 05, 2019   Revised:September 09, 2019   Accepted:September 10, 2019      Published Online:December 18, 2019
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DOI:doi:10.3969/j.issn.1007-7545.2020.01.012
KeyWord:indium-rich slag; oxygen pressure acid leaching; silica gel; leaching rate
           
AuthorInstitution
Shanming He 江西理工大学 冶金工程学院
Xin Wu 江西理工大学 冶金工程学院
Yong Liang 江西理工大学 冶金工程学院
Chunfa Liao 江西理工大学 冶金工程学院
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Abstract:
      Indium-rich slag was treated by oxygen pressure acid leaching process. Effects of initial acid concentration, pressure in autoclave, temperature, time and L/S on indium leaching and silicon precipitation were investigated. The results show that indium leaching rate is 97.3% and silicon precipitation rate is 98.5% under the conditions including initial acid concentration of 120 g/L, L/S=5/1, pressure in autoclave of 0.6 MPa, reaction temperature of 160 ℃,and reaction time of 1.5 h. High pressure and high temperature process can inhibit formation of silica gel during acid leaching of indium-rich slag, and leaching slurry has good filtration performance.
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