Simulation Study on Thermal Field of Copper Slag under Slow Cooling in Summer and Winter
Received:February 07, 2020  Revised:February 17, 2020
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DOI:doi:10.3969/j.issn.1007-7545.2020.06.003
KeyWord:copper slag; slag ladle; slow cooling; thermal field; finite element method
                 
AuthorInstitution
Zhang Hengxing 厦门紫金矿业技术有限公司 福建 厦门
Zhong Shuiping 厦门紫金矿业技术有限公司 福建 厦门
Chen Hang 厦门紫金矿业技术有限公司 福建 厦门
Wang June 厦门紫金矿业技术有限公司 福建 厦门
Wu Xinglin 厦门紫金矿业技术有限公司 福建 厦门
Shi Yu 厦门紫金矿业技术有限公司 福建 厦门
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Abstract:
      Copper slag of flash furnace was taken as research object, and a 3D model was established by ANSYS software to study heat field distribution of copper slag under slow cooling in summer and winter. The results show that temperature of copper slag changes in the same trend in summer and winter. With increase of slow cooling time, temperature drops gradually from inside to outside, and high temperature area continuously shrinks. However, temperature distribution in inner part and side wall of slag ladle in summer is higher than that in winter. Temperature difference in inner part of slag reaches 67.86 ℃ at 12 h. Temperature drops fast at the first two hours with slow cooling water, and temperature fall rate in summer and winter is 86.63 and 100.66 ℃/h respectively. At this stage, temperature drops too fast, which is unfavorable for copper particles growth in slag. Average temperature of side wall of slag ladle is 4.62 ℃ higher in summer than that in winter under natural slow cooling, while 3.96 ℃ higher in summer than that in winter under slow cooling with water. In the later period of water cooling, temperature of slag ladle side wall drops slowly, and cooling effect drops compared with that in former.
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