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| Effect of Sb Content on Electrochemical Corrosion Behavior of Sn-Sb Alloy Solder |
| Received:September 04, 2020 Revised:September 17, 2020 |
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| DOI：doi：10.3969/j.issn.1007-7545.2020.12.013 |
| KeyWord:Sn-Sb alloy; NaCl; electrochemical corrosion; solder; corrosion resistance |
| Author | Institution |
| HAO Yu-hui |
北京科技大学钢铁共性技术协同创新中心 |
| WANG Rong-yue |
北京科技大学钢铁共性技术协同创新中心 |
| YUAN Zhang-fu |
北京科技大学钢铁共性技术协同创新中心 |
| WANG Cun |
北京奥邦新材料有限公司 |
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| Abstract: |
| Applying Sn-xSb(x=0.5%,3%,5%,10%, mass fraction) alloy as working electrode, Pt sheet as counter electrode, saturated calomel electrode (SCE, saturated KCl solution) as reference electrode, and neutral 5% NaCl solution as corrosion solution to evaluate electrochemical reliability of Sn-Sb alloy solder and influence of Sb content on electrochemical corrosion behavior of Sn-Sb alloy solder by electrochemical corrosion test. Through analysis of potential polarization curve and electrochemical impedance spectroscopy (EIS) of alloy samples, it is concluded that corrosion resistance of Sn-Sb alloy solder decreases as Sn-10Sb > Sn-5Sb > Sn-3Sb > Sn-0.5Sb. |
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