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| Research on Nondestructive Disassembly Process of Chips on Printed Circuit Boards of Waste Mobile Phones |
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Received:December 09, 2020
Revised:December 23, 2020
Accepted:December 24, 2020
Published Online:April 20, 2021
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| DOI：doi：10.3969/j.issn.1007-7545.2021.05.018 |
| KeyWord:printed circuit board; nondestructive disassembly; chip |
| Author | Institution |
| DUAN Qi-yu |
上海第二工业大学电子废弃物研究中心 |
| ZHAGN Cheng-long |
上海第二工业大学电子废弃物研究中心 |
| WANG Rui-xue |
上海第二工业大学电子废弃物研究中心 |
| MA En |
上海第二工业大学电子废弃物研究中心 |
| HUANG Qing |
上海第二工业大学电子废弃物研究中心 |
| WANG Jing-wei |
上海第二工业大学电子废弃物研究中心 |
| FU Yong-gao |
中国电器科学研究院股份有限公司 |
| DENG Mei-ling |
中国电器科学研究院股份有限公司 |
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| Abstract: |
| In order to recycle mobile phone chips more efficiently, optimization experiments were carried out on disassembly process of mobile phone printed circuit boards. Two heating methods of air heat convection and heat conduction were chosen to disassemble printed circuit board. Effects of heating rate, holding time and preheating temperature on disassembly process and integrity of disassembled chip were analyzed through experiments. It is determined that heating rate of 3 ℃/s and preheating at 170 ℃ for 90 s have better dismantling effects. There are also slight differences in temperature conditions when disassembling chips with different packaging methods. |
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