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| Fractal Growth of Cu Electrodeposited on Parallel Electrode |
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Received:September 07, 2021
Revised:September 08, 2021
Accepted:September 10, 2021
Published Online:October 20, 2021
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| DOI：doi：10.3969/j.issn.1007-7545.2021.11.006 |
| KeyWord:Cu; electrodeposition; parallel electrode; dendrite; fractal growth |
| Author | Institution |
| XUE Peng |
河南省固体废物和化学品技术管理中心 |
| YI Xiao-xia |
西南科技大学固体废物处理与资源化教育部重点实验室 |
| CHEN Shu-yuan |
西南科技大学固体废物处理与资源化教育部重点实验室 |
| WANG Ji-qin |
西南科技大学固体废物处理与资源化教育部重点实验室 |
| CHEN Meng-jun |
西南科技大学固体废物处理与资源化教育部重点实验室 |
| SHU Jian-cheng |
西南科技大学固体废物处理与资源化教育部重点实验室 |
| WANG Rong |
西南科技大学国防学院 |
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| Abstract: |
| In order to understand dendrite growth (fractal growth) law during copper electrodeposition, effects of additives (HCl, sodium dodecyl sulfate and gelatin), voltage, and Cu2+ concentration on its fractal growth on parallel electrodes were discussed. The results show that voltage and Cu2+ concentration are beneficial to development of cathode copper dendrites, especially high voltage, i.e.25 V, which could significantly impact fractal growth of cathode copper. Compared with no additives, HCl addition can promote fractal and dendrite formation of cathode copper, while the other two additives, sodium dodecyl sulfate and gelatin, can inhibit copper fractal growth. |
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