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| Leaching Kinetics of Copper from Electroplating Sludge by EDTA and EDTA+CA |
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Received:August 09, 2022
Revised:August 13, 2022
Accepted:August 30, 2022
Published Online:November 14, 2022
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| DOI：doi：10.3969/j.issn.1007-7545.2022.12.004 |
| KeyWord:EDTA; citric acid; electroplating sludge; copper; leaching kinetics; Avrami model |
| Author | Institution |
| DENG DI |
南昌航空大学 |
| DENG Chun-jian |
南昌航空大学 |
| LIU Ting-ting |
南昌航空大学 |
| XUE Ding-qian |
南昌航空大学 |
| WU Jia-yi |
南昌航空大学 |
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| Abstract: |
| The metallic copper in electroplating sludge was leached by two leaching agents, EDTA and EDTA mixed with citric acid (EDTA+CA). The effects of EDTA concentration, ratio of CA in EDTA+CA, and temperature on leaching of copper were studied, and the leaching kinetics was analyzed. The results show that copper leaching rate by EDTA is 80.61% under the conditions including EDTA concentration of 70 mmol/L, temperature of 55 ℃, and leaching time of 3 h, while copper leaching rate by EDTA+CA is 90.32% under the conditions including 70 mmol/L EDTA + 10 mmol/L CA, temperature of 55 ℃, and leaching time of 3 h. The leaching process can be described by Avrami equation, and the apparent activation energies of EDTA and EDTA+CA leaching reactions are 43.00 and 45.74 kJ/mol, respectively. The leaching is all mixed control and dominated by surface chemical control. |
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