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| Wetting Process and Interfacial Reaction Behavior of Sn-8.8Zn-xBi Alloys on Sintered NdFeB |
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Received:February 06, 2024
Revised:February 07, 2024
Accepted:February 20, 2024
Published Online:June 05, 2024
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| DOI：doi：10.3969/j.issn.1007-7545.2024.07.014 |
| KeyWord:wettability; NdFeB; Sn-8.8Zn-xBi alloy; interfacial behavior |
| Author | Institution |
| ZHOU Junhong |
北京科技大学 钢铁共性技术协同创新中心 |
| WANG Rongyue |
北京科技大学 钢铁共性技术协同创新中心 |
| YUAN Zhangfu |
北京科技大学 钢铁共性技术协同创新中心 |
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| Abstract: |
| The wettability and wetting interface morphology of Sn-8.8Zn-xBi alloy on NdFeB substrate in Ar-5% H2 atmosphere were investigated by the seated drop method. The results show that the wetting process of Sn-8.8Zn-xBi alloy on NdFeB substrate is divided into two stages: a non-reactive wetting stage driven by van der Waals and diffusion forces, and a reactive wetting stage influenced by the interfacial reaction products and the adsorption of the reaction products. The wettability of Sn-8.8Zn-xBi alloy is improved with the increase of Bi content, and the wetting time is shortened under the same heating condition, in which the contact angle of Sn-8.8Zn-7Bi alloy on the surface of NdFeB substrate is 120.11°. The wetting type of the Sn-8.8Zn-xBi alloy on the NdFeB substrate is the reactive wetting, and the reaction product is ζ-FeZn13 phase. ζ-FeZn13 phase improves the bond strength of Sn-8.8Zn-xBi alloy on the NdFeB surface, which proves that Sn-8.8Zn-xBi alloy can be used as NdFeB surface solder. |
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