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| Effect of Ascorbic Acid on Oxidation Resistance of Electrolytic Copper Foil |
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Received:March 18, 2024
Revised:April 25, 2024
Accepted:April 25, 2024
Published Online:July 09, 2024
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| DOI：doi：10.3969/j.issn.1007-7545.2024.08.015 |
| KeyWord:electrolytic copper foil; anti-oxidation; ascorbic acid; electrochemistry |
| Author | Institution |
| FAN Binfeng |
河南省高精铜箔产业技术研究院 |
| DUAN Fengnan |
河南省高精铜箔产业技术研究院 |
| WANG Qingfu |
河南省高精铜箔产业技术研究院 |
| LI Moucui |
河南省高精铜箔产业技术研究院 |
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| Abstract: |
| Ascorbic acid (AA) as an organic ligand containing multiple hydroxyl groups, is easy to chelate Cu ions to form a coordination polymer attached to the surface of copper foil. Ascorbic acid was used as passivation agent to construct passivation film on surface of electrolytic copper foil by immersion method. The effect of passivation liquid with different concentrations on the oxidation resistance of copper foil surface at high temperature was investigated. It is found that 10 g/L ascorbic acid could significantly improve the corrosion resistance of electrolytic copper foil. The passivation performance of the surface film was studied by electrochemical and related characterization tests. The results show that the self-corrosion current density of the passivated film drops gradually, the voltage increases, and the radius of the high frequency region increases, which have good oxidation resistance. In addition, the surface of the passivation film is smooth and dense, which effectively blocks the erosion of the corrosive medium and can still maintain good process performance of the copper foil. The passivation process is simple in operation and low in cost, and has a good industrial application prospect. |
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